Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
SKU
XZ019
Thermal Paste X5 High Performance, 2.5 g
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
| SKU | XZ019 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| EAN | 4044953501074 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Specification |
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| Manufacturer | Xilence | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Availability | In Stock | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Short Description | Thermal Paste X5 High Performance, 2.5 g | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Description | Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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In stock
£11.45
£9.54